Touch panel and display device with touch panel

ABSTRACT

An electrostatic capacitive coupling type touch panel including an input region having four sides, a peripheral region around the input region, terminals formed in the peripheral region along a first side of the input region, wirings formed In the peripheral region along second, third and fourth sides of the input region, and the input region having X and Y electrodes crossing. The wirings are connected between corresponding X or Y electrodes and wiring terminals plurality of terminals. A dummy wiring, which is not connected to any of the X electrodes or Y electrodes, is provided outside the wiring formed in a farthest position from the input region, and the dummy wiring extends through the peripheral region along the second, third and fourth sides of the input region, and electrically connects to at least one dummy wiring terminal.

CROSS REFERENCE TO RELATED APPLICATION

This application is a continuation of U.S. application Ser. No.12/954,976, filed Nov. 29, 2010, the contents of which are incorporatedherein by reference.

CLAIM OF PRIORITY

The present application claims priority from Japanese Patent ApplicationJP 2009-273054 filed on Dec. 1, 2009, the content of which is herebyincorporated by reference into this application.

BACKGROUND OF THE INVENTION

The present invention relates to a touch panel and a display device witha touch panel, and more particularly, to a technique preferablyapplicable to wiring formed outside an input region.

DESCRIPTION OF RELATED ART

In recent years, for propagation of mobile devices, a touch paneltechnique to support a “user friendly” graphical user interface hasbecome more important.

As this touch panel technique, an electrostatic capacitive coupling typetouch panel is known. As this electrostatic capacitive coupling typetouch panel, a touch panel, where a touch position in which anobserver's finger has touched is detected, is disclosed in JPA2008-310550.

In this specification, an electrostatic capacitive coupling type touchpanel is also called as an electrostatic capacitance type touch panel.They are also may be called a capacitive sensor. A touch panel may becalled a touch sensor.

In the touch panel disclosed in JPA 2008-310550, a coupling capacitancebetween an electrode in an X direction and an electrode in a Y directionis detected so as to detect coordinates of a position where an observerhas touched.

FIG. 7 is a plane view for explanation of the conventional electrostaticcapacitive coupling type touch panel.

As shown in FIG. 7, the conventional electrostatic capacitive couplingtype touch panel has plural X electrodes 1 and plural Y electrodes 2crossing the X electrodes 1.

The plural X electrodes 1 respectively have an electrode pattern where afirst part 1 a and a second part 1 b having a width greater than that ofthe first part 1 a are alternately arranged. The plural Y electrodes 2respectively have an electrode pattern where a first part 2 a and asecond part 2 b having a width greater than that of the first part 2 aare alternately arranged.

A region where the plural X electrodes 1 and the plural Y electrodes 2are formed is an input region ERI. In a peripheral region providedaround the input region ERI, plural wiring layers ML connected to theplural X electrodes 1 and the plural Y electrodes 2 are provided.

Note that as shown in FIG. 8, the wiring layer ML has a transparentconductive layer (ITO; Indium Tin Oxide) 10 as a lower layer and a metallayer 11 of silver alloy material or the like. Note that FIG. 8 is anenlarged view of a corner of the wiring layer ML show in FIG. 7.

The above-described wiring layer ML is formed in a process as shown inFIGS. 9A to 9D.

(1) A transparent conductive film F10 as a transparent conductive layeris formed on the entire surface of a substrate (e.g., a transparentsubstrate such as a glass substrate) 21 (FIG. 9A).(2) Next, a metal film as the metal layer 11 is formed on theabove-described transparent conductive film F10, and the metal layer 11as an upper layer of the wiring layer ML is formed with a series ofphotolithographic technique (FIG. 9B).(3) Next, a resist film is formed on the metal layer 11 using e.g.positive resist, then irradiated with light (e.g., ultraviolet light)using a transparent conductive layer formation photomask MSK, then theresist film is selectively developed, thereby a resist film RF is leftonly on the metal layer 11 (FIG. 9C).(4) Next, the transparent conductive film F10 is etched by wet etching,thereby the resist film RF is removed, thus the transparent conductivefilm F10 is formed (FIG. 9D).

Note that generally, as shown in FIG. 10, in the transparent conductivelayer formation photomask MSK, a mask pattern MPA for forming thetransparent conductive layer 10 is formed, with a chrome (Cr) film, on alight (e.g. ultraviolet light) transmitting substrate MSB.

As the surface of the transparent conductive layer formation photomaskMSK is contaminated by chemical reaction or the like of the resist filmRF upon light irradiation, it is necessary to clean the transparentconductive layer formation photomask MSK.

However, the chrome film mask pattern MPA of the transparent conductivelayer formation photomask MSK is deteriorated by the cleaning.Especially, the deterioration of the chrome film mask pattern MPA isserious at a corner of the wiring layer ML formed in a position farthestfrom the input region ERI.

Accordingly, it is conceivable that as shown in FIGS. 11A and 11B, thepattern of the resist film RF becomes thin due to the deterioration ofthe chrome film mask pattern MPA of the transparent conductive layerformation photomask MSK, then the corners become rounded, and a part ofthe metal layer 11 is protruded from the resist film RF. Note that FIGS.11A and 11B are cross-sectional views showing the resist film RF, formedon the metal layer 11 using the transparent conductive layer formationphotomask MSK in which the chrome film mask pattern MPA is deteriorated.

In the state shown in FIGS. 11A and 11B, when wet etching is performedso as to form the transparent conductive layer 10, the etchant erodesand etches the metal layer 11 as shown in FIG. 12, accordingly, thewiring layer ML becomes chipped or wire-broken.

SUMMARY OF THE INVENTION

The present invention has been made so as to address the above-describedproblem of the conventional technique, and provides a technique in atouch panel to prolong a period before wiring formed outside an inputregion is chipped or wire-broken due to deterioration of a mask pattern.

Among aspects of the present invention disclosed in the presentapplication, the outline of typical aspect is as follows.

According to an aspect of the present invention, provided is anelectrostatic capacitive coupling type touch panel having: an inputregion; and a plurality of wirings formed around the input region, theinput region having a plurality of X electrodes and a plurality of Yelectrodes crossing the X electrodes, the plurality of wiringsrespectively being connected to corresponding electrodes of theplurality of X electrodes and the plurality of Y electrodes, wherein theplurality of wirings respectively have: a conductive layer; and a metallayer formed on the conductive layer, wherein the conductive layer isformed to have a width greater than that of the metal layer, wherein theplurality of wirings have a corner, and wherein, in a wiring provided ina farthest position from the input region, among the plurality ofwirings, the corner of the metal layer is chamfered.

In the touch panel, assuming that a width of a chamfered portion of themetal layer at the corner of the wiring formed in the farthest positionfrom the input region is W1, and a mean value of the widths of the metallayers in linear portions of the wiring formed in the farthest positionfrom the input region is W2, 0.8×W2≤W1≤1.2×W2 is satisfied.

Further, according to another aspect of the present invention, providedis an electrostatic capacitive coupling type touch panel having: aninput region; and a plurality of wirings formed around the input region,the input region having a plurality of X electrodes and a plurality of Yelectrodes crossing the X electrodes, the plural wirings respectivelybeing connected to corresponding electrodes of the plurality of Xelectrodes and the plurality of Y electrodes, wherein the plurality ofwirings respectively have: a conductive layer; and a metal layer formedon the conductive layer, wherein the conductive layer is formed to havea width greater than that of the metal layer, and wherein a dummywiring, not connected to any of the plurality of X electrodes or theplurality of Y electrodes, is provided outside the wiring formed in afarthest position from the input region, among the plurality of wirings.

In the touch panel, the dummy wiring is supplied with a referencevoltage.

In any one of the above-described touch panels, the conductive layer hasa transparent conductive film.

In any one of the touch panel, the plurality of wirings respectivelyhave an upper conductive layer provided on the metal layer with aninsulating film therebetween, and the upper conductive layer iselectrically connected to the conductive layer of the plurality ofwirings.

In the above-described touch panel, the conductive layer and the upperconductive layer have a transparent conductive film.

In any one of the above-described touch panels, the X electrode and theY electrode have a transparent conductive film.

In any one of the above-described touch panels, the X electrode and theY electrode are formed with an insulating film therebetween.

In any one of the above-described touch panels, the X electrode and theY electrode have an intersection part between the X electrode and the Yelectrode and an electrode part formed between two intersection parts,the electrode part and the intersection part of the X electrode and theelectrode part of the Y electrode are formed on the same layer, and theintersection part of the Y electrode is formed on a different layer,with an insulating layer therebetween.

Further, according to another aspect of the present invention, providedis a display device with touch panel wherein any one of theelectrostatic capacitive coupling type touch panel is provided on asurface of a display panel on the observer side.

Among aspects of the present invention disclosed in the presentapplication, the effects of typical aspect are as follows.

In accordance with the touch panel according to the present invention,it is possible to prolong a period before wiring formed on the outsideof an input region is chipped or wire-broken due to deterioration of amask pattern.

Other features and advantages of the present invention will be apparentfrom the following description taken in conjunction with theaccompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a plane view showing an electrode pattern of an electrostaticcapacitance type touch panel as a presupposed element of the presentinvention;

FIG. 2 is a cross-sectional view showing a structure along a line A-A′in FIG. 1;

FIG. 3 is a cross-sectional view showing a structure along a line B-B′in FIG. 1;

FIG. 4 is an enlarged view of a corner of a wiring layer provided in afarthest position from an input region among plural wiring layersprovided in a peripheral region of the electrostatic capacitance typetouch panel in an embodiment of the present invention;

FIG. 5 is a schematic view of an arrangement of wiring layers MLprovided in the peripheral region of the electrostatic capacitance typetouch panel in the embodiment of the present invention;

FIG. 6 is a schematic view of a display device with touch panel usingthe electrostatic capacitance type touch panel in the respectiveembodiments of the present invention;

FIG. 7 is a plane view for explanation of a conventional electrostaticcapacitive coupling type touch panel;

FIG. 8 is an enlarged view of a corner of the wiring layer ML in FIG. 7;

FIGS. 9A to 9D are cross-sectional views for explanation of amanufacturing method of the wiring layer in FIG. 7;

FIG. 10 is a cross-sectional view for explanation of a transparentconductive layer formation photomask;

FIGS. 11A and 11B are cross-sectional views showing the resist film RF,formed on the metal layer 11 using the transparent conductive layerformation photomask in which a chrome film mask pattern is deteriorated;and

FIG. 12 is a cross-sectional view showing the wiring layer after etchingin the state shown in FIG. 11.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

Hereinbelow, embodiments of the present invention will be described indetail in accordance with the accompanying drawings.

Note that in all the figures for explanation of the embodiments,elements having the same function will have the same reference numeralsand repeated explanations thereof will be omitted.

[Structure of Touch Panel as Presupposed Element of Present Invention]

FIG. 1 is a plane view showing an electrode pattern of an electrostaticcapacitance type touch panel as a presupposed element of the presentinvention.

FIG. 2 is a cross-sectional view showing a structure along a line A-A′in FIG. 1.

FIG. 3 is a cross-sectional view showing a structure along a line B-B′in FIG. 1.

An electrostatic capacitance type touch panel 20, as a presupposedelement of the present invention, has plural X electrodes 1, extended ina first direction (e.g. in an X direction) and provided in parallel at apredetermined array pitch in a second direction (e.g. a Y direction)crossing the first direction, and plural Y electrodes 2 extended in thesecond direction crossing the plural X electrodes 1 and provided inparallel at a predetermined array pitch in the first direction, on thesurface of a substrate 21 on the observer side.

The plural Y electrodes 2 respectively have an electrode pattern where afirst part 2 a and a second part 2 b having a width greater than that ofthe first part 2 a are alternately arranged in the second direction. Theplural Y electrodes 2 are provided on the surface of the substrate 21 onthe observer side. As the substrate 21, a transparent insulatingsubstrate such as a glass substrate is used.

The plural X electrodes 1 respectively have an electrode pattern where afirst part 1 a and a second part 1 b having a width greater than that ofthe first part 1 a are alternately arranged in the first direction. Thefirst parts 1 a of the plural X electrodes 1 are provided on aninsulating film 12 formed on the surface of the substrate 21 on theobserver side.

The second parts 1 b of the plural X electrodes 1 are formed separatelyfrom the Y electrodes 2 on the surface of the substrate 21 on theobserver side. Note that the first parts 1 a of the plural X electrodes1 are covered with a protective film 13 formed as an upper layer.

The first part 1 a of the X electrode 1 two-dimensionally crosses thefirst part 2 a of the Y electrode 2, and electrically connected to twoadjacent second parts 1 b with the first part 2 a therebetween via acontact hole 12 a formed in an insulating film 12 as an interlayerinsulating film between the first part 1 a of the X electrode 1 and theY electrode 2.

In a plan view, the second part 2 b of the Y electrode 2 is providedbetween the respective first parts 1 a of two adjacent X electrodes 1.Also in a plan view, the second part 1 b of the X electrode 1 isprovided between the respective first parts 2 a of two adjacent Yelectrodes 2. That is, the Y electrode 2 has a portion wider than thewidth of a portion crossing the X electrode 1 between the X electrodes1, and the X electrode 1 has a portion wider than the width of a portioncrossing the Y electrode 2 between the Y electrodes 2.

A region where the plural Y electrodes 2 and X electrodes 1 are providedis an input region ERI. As shown in FIG. 1, plural wiring layers MLelectrically connected to the respective plural Y electrodes 2 and therespective plural X electrodes 1 are provided around the input regionERI. The plural wiring layers ML electrically connect the plural Yelectrodes 2 and the plural X electrodes 1 to drive circuits.

As shown in FIGS. 2 and 3, the plural wiring layers ML are provided onthe surface (main surface) of the substrate 21 on the observer side, andcovered with an insulating film 12 formed as an upper layer. The pluralwiring layers ML are electrically connected to corresponding electrodes(the X electrodes 1 and the Y electrodes 2) at ends of the respectiveelectrodes (the X electrodes 1 and the Y electrodes 2).

The plural X electrodes 1 and the plural Y electrodes 2 are formed withtransparent conductive material or the like having high transparencysuch as ITO (Indium Tin Oxide). Further, the wiring layer ML has atransparent conductive layer 10 formed of transparent conductivematerial such as ITO as a lower layer and a metal layer 11 formed ofe.g. silver alloy as an upper layer.

Further, each of the plural wiring layers ML is formed on the metallayer 11 with the insulating film 12 therebetween, and has an uppertransparent conductive layer 10U of transparent conductive material suchas ITO. The upper transparent conductive layers 10U are electricallyconnected to the respective transparent conductive layers 10 of theplural wiring layers ML via contact holes 12 b formed in the insulatingfilm 12 near the terminals of the wiring layer ML.

The touch panel 20 in the present embodiment receives a signal outputtedfrom the drive circuit via a wiring on a flexible printed circuit boardconnected to one side of the touch panel 20.

Note that through holes are formed in the wirings on the flexibleprinted circuit board, and the wiring is electrically connected tocrossing wiring on the rear side via the through hole. The crossingwirings cross a large number of wirings, and again connected to thewirings via through holes formed at the other end. In the presentembodiment with this arrangement, the respective plural X electrodes 1and plural Y electrodes 2 are supplied with driving voltages outputtedfrom the drive circuits from both sides.

Next, the method of manufacturing the electrostatic capacitance typetouch penal 20 as a presupposed element of the present invention will bedescribed with reference to FIGS. 1 to 3.

(1) First, a first transparent conductive film as a transparentconductive layer is formed on the entire surface of the substrate (e.g.a transparent substrate such as a glass substrate) 21 on the observerside (see above-described FIG. 9A).(2) Next, a metal film as the metal layer 11 is formed on theabove-described first transparent conductive film, and the metal layer11 as an upper layer of the wiring layer ML is formed by thephotolithographic technique (see above-described FIG. 9B).(3) Next, a first mask having an electrode pattern and wiring layerconductive film pattern is formed using e.g. positive resist on themetal layer 11. Then the first transparent conductive film is etchedusing the above-described first mask as an etching mask, thereby theplural Y electrodes 2, the second parts 1 b of the plural X electrodes1, and the transparent conductive layer 10 as a lower layer of thewiring layer ML are formed (see above-described FIGS. 9C and 9D). Inthis process, respective ends of the X electrodes 1 and the Y electrodes2 are electrically connected to corresponding wiring layers ML.(4) Next, the above-described first mask is removed, then, theinsulating film 12 of e.g. negative resist is formed on the substrate 21including the plural Y electrodes 2, the second parts 1 b of the pluralX electrodes 1 and the wiring layers ML. In this process, the plural Yelectrodes 2, the second parts 1 b of the plural X electrodes 1 and thewiring layers ML are covered with the insulating film 12.(5) Next, the contact holes 12 a and 12 b are formed in necessarypositions of the insulating film 12, then, a second transparentconductive film as a transparent conductive layer is formed on theentire surface of the insulating film 12 including the contact holes 12a and 12 b.(6) Next, a second mask having a pattern of the first parts 1 a of theplural X electrodes 1 and the wiring layers LM is formed using e.g.positive resist on the transparent conductive film, then, theabove-described second transparent conductive film is etched using theabove-described second mask as an etching mask, thereby the first parts1 a of the plural X electrodes 1 a and the upper transparent conductivelayers 10U of the wiring layers ML are formed on the insulating film 12.In this process, the first parts 1 a of the upper-layer plural Xelectrodes 1 are electrically connected to the second parts 1 b of thelower-layer X electrodes 1 via the contact holes 12 a. Further, theupper transparent conductive layers 10U of the respective wiring layersML are electrically connected to the transparent conductive layers 10 ofthe respective wiring layers ML via the contact holes 12 b.(7) Next, the above-described second mask is removed, then theprotective film 13 of e.g. negative resist is formed on the insulatingfilm 12 including the first parts 1 a of the plural X electrodes 1 andthe upper transparent conductive layers 10U, thereby the structure shownin FIGS. 1 to 3 is obtained. In this process, the first parts 1 a of theX electrodes 1 and the upper transparent conductive layers 10U arecovered with the protective film 13.

Note that in the above explanation, it may be arranged such that the Xelectrodes 1 and the Y electrodes 2 are formed on different layers. Forexample, the Y electrodes 2 may be formed on the insulating film 12. Inthis case, it is necessary to electrically connect the Y electrodes 2 tothe wiring layers ML via the contact holes formed in the insulating film12.

Embodiment 1

FIG. 4 is an enlarged view of a corner of the wiring layer ML providedin a farthest position from the input region ERI among plural wiringlayers ML provided in the peripheral region of the electrostaticcapacitance type touch panel 20 in an embodiment 1 of the presentinvention.

As shown in FIG. 4, as the feature of the present embodiment, thepattern of a mask for formation of the metal layer 11 as an upper layerof the wiring layer ML is changed and the metal layer 11 is chamfered atcorners of the wiring layer ML. Assuming that the minimum width (thewidth of a narrowest portion) of the chamfered portion of the metallayer 11 at a corner of the wiring layer ML is W1, and a mean value ofwidths of the metal layer 11 in linear portions of the wiring layer MLformed in the farthest position from the input region is W2,0.8×W2≤W1≤1.2×W2 is satisfied.

In this arrangement, in the present embodiment, as shown in FIGS. 11Aand 11B, even when the pattern of a resist film RF is thinned and thecorners are rounded due to deterioration of a mask pattern MPA of atransparent conductive layer formation photomask MSK, a period before apart of the metal layer 11 is protruded from the resist film RF can beprolonged. That is, in the present embodiment, the tolerance to theprotrusion of the metal layer 11 as an upper layer of the wiring layerML from the resist film RF can be improved.

Accordingly, in the present embodiment, since a period before the wiringlayer ML is chipped or wire-broken due to deterioration of the maskpattern MPA of the transparent conductive layer formation photomask MSKcan be prolonged, the tolerance to wire-breakage of the wiring layer MLdue to deterioration of the mask pattern MPA of the transparentconductive layer formation photomask MSK can be improved.

Embodiment 2

FIG. 5 is a schematic view of an arrangement of the wiring layers MLprovided in the peripheral region of the electrostatic capacitance typetouch panel 20 in an embodiment 2 of the present invention.

As shown in FIG. 5, as the feature of the present embodiment, a dummywiring layer MLD is formed outside the wiring layer ML provided in thefarthest position from the input region ERI among the plural wiringlayers ML. In the present embodiment, as in the case of the respectivewiring layers ML, the dummy wiring layer MLD, having the transparentconductive layer 10 as a lower layer, the metal layer 11 as an upperlayer and the upper transparent conductive layer 10U, is provided at thesame interval as that of the respective wiring layers ML. Further, thedummy wiring layer MLD is not electrically connected to any of theplural Y electrodes 2 or the plural X electrodes 1.

Generally, the mask pattern MPA of the transparent conductive layerformation photomask MSK is deteriorated in the cleaning process for thetransparent conductive layer formation photomask MSK. The deteriorationof the transparent conductive layer formation mask pattern MPA of theoutermost wiring layer ML is extremely serious, while the deteriorationof the transparent conductive layer formation mask pattern MPA in aninner position is extremely slight.

Accordingly, in the present embodiment, since a period before thepattern of the resist film RF is thinned and the corners are rounded dueto the deterioration of the mask pattern MPA of the transparentconductive layer formation photomask MSK can be prolonged, the periodbefore a part of the metal layer 11 is protruded from the resist film RFcan be prolonged. Accordingly, in the present embodiment, since theperiod before the wiring layer ML is chipped or wire-broken due to thedeterioration of the mask pattern MPA of the transparent conductivelayer formation photomask MSK can be prolonged, the tolerance tobreakage of the wiring layer ML due to the deterioration of the maskpattern MPA of the transparent conductive layer formation photomask MSKcan be improved. Note that in the present embodiment, it may be arrangedsuch that a ground potential or the like is supplied to the dummy wiringlayer MLD.

FIG. 6 is a schematic view of a display device with touch panel usingthe electrostatic capacitance type touch panel in the above-describedembodiments.

The display device with touch panel shown in FIG. 6 has a liquid crystaldisplay panel 30, the electrostatic capacitance type touch panel 20 inthe above-described embodiments, provided on the surface of the liquidcrystal display panel 30 on the observer side, and a backlight 40provided under the surface of the liquid crystal display panel 30 on theside opposite to the observer side. As the liquid crystal display panel30, an IPS type liquid crystal display panel, a TN type liquid crystaldisplay panel, a VA type liquid crystal display panel or the like isused. The liquid crystal display panel 30 has a display region whereplural pixels are provided in a matrix array and a non-display regionprovided around the display region.

Further, in FIG. 6, the display device with touch panel in which thetouch panel is provided on the liquid crystal display panel is describedas an example of the display panel. However, the present invention isnot limited to this arrangement. The present invention is alsoapplicable to a display device with touch panel in which the touch panelis provided on another display panel such as an organic EL display panelor an inorganic EL display panel.

The present invention made by the inventors has been specificallydescribed based on the above-describe embodiments. However, the presentinvention is not limited to the above embodiments, and various changescan be made without departing from the scope of the present invention.

What is claimed is:
 1. A touch panel comprising: a substrate; an inputregion including a plurality of electrodes; a peripheral region outsideof the input region; a plurality of connecting terminals formed in theperipheral region; and a plurality of wirings formed in the peripheralregion and electrically connecting the plurality of electrodesrespectively, wherein each of the plurality of electrodes has anelectrode part, a width of the electrode part is wider than that of theplurality of wirings, wherein a dummy wiring, which is not connected toany of the plurality of electrodes, is provided in the peripheral regionalong with and outside of a corner of the input region, a corner portionof the dummy wiring along the corner of the input region bends only onceat a first angle and has an outer edge, the outer edge of the cornerportion of the dummy wiring has an obtuse angle, the first angle issmaller than the obtuse angle, and the plurality of electrodes and theplurality of wirings are made of a same material.
 2. The touch panelaccording to claim 1, wherein the dummy wiring is supplied with areference voltage.
 3. The touch panel according to claim 1, wherein theplurality of electrodes are made of a transparent conductive film. 4.The touch panel according to claim 1, wherein the plurality of wiringsrespectively have an upper conductive layer and a lower conductivelayer.
 5. The touch panel according to claim 4, wherein the upperconductive layer of each of the plurality of wirings are made of atransparent conductive film.
 6. The touch panel according to claim 4,wherein the lower conductive layer of each of the plurality of wiringsare made of a metal film.
 7. The touch panel according to claim 1,wherein the electrodes have an X-electrode and a Y-electrodeintersecting the X-electrode.
 8. The touch panel according to claim 7,wherein the X-electrode and the Y-electrode have an intersection partbetween the X-electrode and the Y-electrode and the electrode partformed between two intersection parts; wherein the electrode part andthe intersection part of the X-electrode and the electrode part of theY-electrode are formed on the same layer; and wherein the intersectionpart of the Y-electrode is formed on a different layer than the layer ofthe intersection part of the X-electrode, with an insulating layer therebetween.
 9. A touch panel comprising: a substrate; an input regionincluding a plurality of electrodes; a peripheral region outside of theinput region; a plurality of connecting terminals formed in theperipheral region; and a plurality of wirings formed in the peripheralregion and electrically connecting between the plurality of electrodesand the plurality of connecting terminals respectively, wherein each ofthe plurality of electrodes has an electrode part, a width of theelectrode part is wider than that of the plurality of wirings, wherein adummy wiring, which is not connected to any of the plurality ofelectrodes, is provided in the peripheral region along with and outsideof a corner of the input region, and connects to a pair of connectingterminals which are formed at both ends of the plurality of connectingterminals, the dummy wiring has a corner along an outermost corner ofthe plurality of wirings, the corner of the dummy wiring bends at afirst angle and has an outer edge, the outer edge of the dummy wiringbends at a second angle which is greater than the first angle, thecorner of the dummy wiring bends only once at the corner of the dummywiring, and the plurality of electrodes and the plurality of wirings aremade of a same material.
 10. The touch panel according to claim 9,wherein the dummy wiring is supplied with a reference voltage.
 11. Thetouch panel according to claim 9, wherein the plurality of electrodesare made of a transparent conductive film.
 12. The touch panel accordingto claim 9, wherein the plurality of wirings respectively have an upperconductive layer provided over a lower conductive film, which has ametal layer, an insulating film is formed between the lower conductivefilm and the upper conductive film.
 13. The touch panel according toclaim 12, wherein the upper conductive layer of each of the plurality ofwirings are made of a transparent conductive film.
 14. The touch panelaccording to claim 9, wherein the electrodes have an X-electrode and aY-electrode intersecting the X-electrode.
 15. The touch panel accordingto claim 14, wherein the X-electrode and the Y-electrode are formed withan insulating film there between.
 16. The touch panel according to claim14, wherein the X-electrode and the Y-electrode have an intersectionpart between the X-electrode and the Y-electrode and the electrode partformed between two intersection parts; wherein the electrode part andthe intersection part of the X-electrode and the electrode part of theY-electrode are formed on the same layer; and wherein the intersectionpart of the Y-electrode is formed on a different layer than the layer ofthe intersection part of the X-electrode, with an insulating layer therebetween.
 17. A touch panel comprising: a substrate; an input regionincluding a plurality of electrodes; a peripheral region outside of theinput region; a plurality of connecting terminals formed in theperipheral region and arranged between a short edge of the substrate andthe input region; and a plurality of wirings formed in the peripheralregion and electrically connecting between the plurality of electrodesand the plurality of connecting terminals respectively, wherein each ofthe plurality of electrodes has an electrode part, a width of theelectrode part is wider than that of the plurality of wirings, wherein adummy wiring, which is not connected to any of the plurality ofelectrodes, is provided in the peripheral region along with and outsideof a corner of the input region, and connects to a pair of connectingterminals which are formed at both ends of the plurality of connectingterminals, the dummy wiring has a corner along with a corner of theinput region, the corner of the dummy wiring bends at a first angle andhas a turned outer edge, a turn of the outer edge is more gradual thanthe first angle, the corner of the dummy wiring bends only once at thecorner of the dummy wiring, and the plurality of electrodes and theplurality of wirings are made of a same material.
 18. The touch panelaccording to claim 17, wherein the dummy wiring is supplied with areference voltage.
 19. The touch panel according to claim 17, whereinthe plurality of wirings respectively is made of a metal layer.
 20. Thetouch panel according to claim 17, wherein the plurality of wiringsrespectively is made of a metal layer and a transparent conductivelayer.